WHD solder bar
1，DESCRIPTION
The product of lead-free solder alloy is to use high purity metal materials, under the condition of the strict quality control, the vacuum degreasing process, effectively control the degree of oxidation and metal, nonmetal, impurity content, solder surface smooth, high purity, good melts flow, wetting, bright spot, residual slag oxidation, suitable for high quality requirements of various wave welding and manual welding, alloy composition in accordance with GB/T3131-2001 alloy component specifications..
2,PRODUCTION INFORMATION
Model | Sn96.5Ag3.0Cu0.5 | Sn99.0Ag0.3Cu0.7 | Sn99.3Cu0.7 | Sn96.5Ag3.5 | Sn97.0Ag3.0 |
Sn（wt%） | 余量 | 余量 | 余量 | 余量 | 余量 |
Other mental standard（wt%） | Ag：3.0±0.2 | Ag：0.3±0.1 | Cu：0.7±0.2 | Ag：3.5±0.2 | Ag：3.0±0.2 |
Melting point (℃) | 217 | 217～227 | 227 | 221 | 219 |
Operating temperature (℃) | 260±10 | 260±10 | 260±10 | 260±10 | 260±10 |
SPECIFIC GRAVITY | 7.36 | 7.36 | 7.36 | 7.36 | 7.36 |
3，Alloy composition（Standard：JIS Z 3282-1999A）
LEVEL | Sn | 微量金属含量（wt%）OTHER METAL STANDARD | |||||||
Pb | Sb | Bi | Zn | Fe | Al | As | Cd | ||
A | BALANCE | 0.10 MAXIMUM | 0.12 MAXIMUM | 0.10 MAXIMUM | 0.002 MAXIMUM | 0.02 MAXIMUM | 0.002 MAXIMUM | 0.03 MAXIMUM | 0.002 MAXIMUM |
