CVP390
ALPHA® CVP-390
NO-CLEAN, LEAD-FREE SOLDER PASTE ZERO-HALOGEN, LOW VOIDS, FINE FEATURE, EXCELLENT PIN TEST PERFORMANCE, SAC305, SAC405, & LOW AG CAPABLE
DESCRIPTION：
ALPHA CVP-390 is a lead-free, Zero-halogen no-clean solder paste designed for applications where
residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required.
This product is also designed to enable consistent fine pitch printing capability, down to 180m circle
printed with 100m thickness stencil. Its excellent print volume deposit repeatability also provides value
by reducing defects associated with print process variability. Additionally, ALPHA CVP-390 achieves
IPC7095 Class III voiding performance.
FEATURES & BENEFITS：
• Long Stencil Life: consistent performance for at least 8 hours of continuous printing without addition
of new paste
• Long, High Tack Force Life: ensures high pick-and-place yields, good self-alignment
• Wide Reflow Profile Window: allows best quality solderability of complicated, high density PWB
assemblies in both air and nitrogen reflow, using ramp and soak profiles, as high as 175 to 185°C
• Reduced Random Solder Ball Levels: minimizes rework and increases first time yield
• Excellent Coalescence and Wetting Performance: coalesced 180µm circle deposit, even at high
soak profile environment
• Excellent Solder Joint and Flux Residue Cosmetics: after reflow soldering, even using long/high
thermal soaking, without charring or burning
• Excellent Voiding Performance: Meets IPC7095 Class III Requirement
• Halogen Content: Zero Halogen, no halogen intentionally added
• Residue: Excellent Pin Testing property and Pass JIS Copper Corrosion Test
• Safe and Environmentally Friendly: Materials comply with RoHS and Halogen-free requirements
(see table below), as well as TOSCA & EINECS
PRODUCT INFORMATION：
Alloys: SAC105, SAC305, SAC405, SACX Plus 0307 SMT,
SACX Plus 0807 SMT, Innolot, Maxrel Plus, Sn99.3/Cu0.7, 90Sn10Sb,
95Sn5Sb, For other alloys, contact your local Alpha Sales Office
Powder Size: Type 3, Type 4, Type 4.5, Type 5, Type 6, & Type 7
Packaging Sizes: 500 gram jars, 10cc & 30cc syringe, 6” & 12” cartridges
Flux Gel: Flux gel is available in 10 and 30 cc syringes for rework applications
Lead Free: Complies with RoHS Directive 2011/65/EC
APPLICATION：
Formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/sec (1”/sec)
and 150mm/sec (6”/sec), with stencil thickness of 0.100mm (0.004”) to 0.150mm (0.006”), particularly when
used in conjunction with ALPHA Stencils. Blade pressures should be 0.21-0.36 kg/cm of blade (1.25 -1.5
Ibs/inch), depending upon the print speed. The higher the print speed employed, the higher the blade
pressure that is required. The reflow process window will give high soldering yield with good cosmetics and
minimized rework.
HALOGEN STATUS：
TECHNICAL DATA：
PHYSICAL PROPERTIES：
SAFETY：
While the ALPHACVP-390 flux system is not considered toxic, its use in typical reflow will generate a small
amount of reaction and decomposition vapors. These vapors should be adequately exhausted from the
work area. Consult the SDS (available at www.AlphaAssembly.com) for all safety information.
STORAGE & HANDLING：
1. Refrigerate to guarantee stability
@ 0-10°C (32-50°F). When stored
under these conditions, the shelf
life of CVP-390 is 6 months.
2. Paste can be stored for 4 weeks
at room temperature up to
25°C(77°F) prior to use
3. When refrigerated, warm up
paste container to room
temperature for up to 4 hours.
Paste must be 19°C (66°F) before
processing. Verify paste
temperature with a thermometer to
ensure paste is at 19°C (66°F) or
greater before set up of printer.
4. Paste can be manually stirred
before use. A rotating/Centrifugal
force mixing operation is not
required. If a rotating/centrifugal
force mixing is used, 30 - 60
seconds at 300 RPM is adequate.
5. Do not remove worked paste
from stencil and mix with unused
paste in jar. This will alter the
rheology of unused paste.
6. These are starting
recommendations and all process
settings should be reviewed
independently.
PRINTING：
STENCIL: Recommend
ALPHA CUT, ALPHA
NICKEL-CUT, ALPHA
TETRABOND®
, or ALPHA
FORM stencils @
0.100mm - 0.150 mm (4-6
mil) thick for 0.4 - 0.5 mm
(0.016” or 0.020”) pitch.
Stencil design is subject to
many process variables.
Contact your local Alpha
stencil site for advice.
SQUEEGEE:
Metal (recommended)
PRESSURE: 0.21 - 0.36
kg/cm of blade (1.25 -2.0
Ibs/inch)
SPEED: 25 – 150 mm per
second (1 – 6 inches per
second).
PASTE ROLL: 1.5-2.0 cm
diameter and make
additions when roll reaches
1-cm (0.4”) diameter (min).
Max roll size will depend
upon blade.
STENCIL RELEASE
SPEED: 1 – 5 mm/sec.
LIFT HEIGHT: 8 – 14mm
(0.31- 0.55”)
REFLOW (see Fig. 1)：
ATMOSPHERE: Clean-dry
air or nitrogen atmosphere.
PROFILE (SAC Alloys):
Straight Ramp: 0.7°C/sec &
1.3°C/sec ramp profiles, 45 - 90 TAL.
Soak: 155–175 °C, 60 to 100
sec soak profiles have been
determined to give optimal
results. If required, good
results are also achievable
with high soak temperature
profiles of 170 –185°C for 60
s. Typical peak temperature
is 235 to 245°C.
Note 1: Keeping the peak
temperature below 241ºC
may reduce the number and
size of BGA and QFN voids.
Note 2: Refer to component
and board supplier data for
thermal properties at elevated
temperatures. Lower peak
temperatures require longer
TAL for improved joint
cosmetics.
CLEANING：
ALPHA CVP-390 residue
is designed to remain on
the board after reflow. If
reflowed residue cleaning
is required, Vigon® A201
(in line cleaning), Vigon A
250 (Batch Cleaning) or
Vigon US (Ultrasonic
Cleaning) are
recommended. Vigon is a
registered trademark of
Zestron.
Misprints and stencil
cleaning may be done with
IPA, ALPHA SM-110E,
ALPHA SM-440, and
Bioact® SC-10E cleaners.
Bioact is a registered
trademark of Petroferm.
CONTACT INFORMATION：
