OM340

ALPHA® OM-340 (r) Solder Paste 

No-Clean Lead-Free, Fine Feature, Zero Halogen, Low HIP, Highly PinTestable

DESCRIPTION：

ALPHA OM-340 (r) is a lead-free, no-clean solder paste designed for a broad range of applications. 

It provides best in class low defect rate for Head in Pillow defects combined with excellent first pass yield on ICT/pin testing. ALPHA OM-340 (r) also yields excellent print capability performance across various board designs and, particularly, with ultra-fine feature repeatability and high “through- put” applications. Outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-340 (r) is formulated to deliver excellent visual joint cosmetics and best in class in circuit pin test yields. Additionally, ALPHA OM-340 (r)’s capability of IPC Class III for

voiding and ROL0 IPC classifications ensures maximum long-term product reliability.

FEATURES & BENEFITS：

• Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular

dimensions as small as 200μm (8 mil) with 100μm (4 mil) thick stencils • Excellent print consistency with high process capability index across all board designs • Print speeds of up to 150mm/sec (6”/sec), enabling a fast print cycle time and a high throughput • Wide reflow profile window with good solderability on various board / component finishes • Excellent solder and flux cosmetics after reflow soldering

• Best in class low defect rate for Head in Pillow • Best in class in circuit pin test yield • Reduction in random solderballing levels, minimizing rework and increasing first time yield • Meets highest IPC 7095 voiding performance classification of Class III

• Excellent reliability properties, halide-free material

• Compatible with either nitrogen or air reflow • Zero halogen (No halogen intentionally added to the formulation)

PRODUCT INFORMATION：

Alloys: SAC305, SAC405, Sn96%Ag4%, SACX® Plus™ 0307, SACX® Plus™ 0807, InnoLot™, Maxrel™ Plus

Powder Size: Type 3, Type 4, Type 4.5 (proprietary), Type 5, Type 6 ((≤ 20μm)

Packaging Sizes: 500 gram jars, 6” & 12” cartridges, and 10cc and 30cc dispense syringes.

FluxGel: OM-340 (r) Flux Gel is available in 10cc and 30cc syringes for rework

applications. 

Lead Free: Complies with RoHS Directive 2011/65/EU

APPLICATION：

Formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/sec 

(1”/sec) and 150mm/sec (6”/sec), with stencil thickness of 100μm (4 mil) to 150μm (6 mil), particularly 

when used with ALPHA Stencils. Blade pressures should be 0.18-0.27 kg/cm of blade (1.0 -1.5 

Ibs/inch), depending upon the print speed. The higher the print speed employed, the higher the blade 

pressure that is required. The reflow process window will give high soldering yield with good 

cosmetics and minimized rework.

HALOGEN STATUS：

SAFETY：

While the ALPHA OM-340 (r) flux system is not considered toxic, its use in typical reflow will 

generate a small amount of reaction and decomposition vapors. These vapors should be

adequately exhausted from the work area. Consult the SDS for additional safety information. The 

most recent version of the SDS is available from alpha.alent.com.

TECHNICAL DATA：

PROCESSING GUIDELINES：

STORAGE and HANDLING：

• Refrigerate to guarantee stability

@ 0-10C (32-50F)

• Shelf life of refrigerated paste is 6 months. • Paste can be stored for 2 weeks at room temperatures up to 25°C 

(77F) prior to use. • When refrigerated, warm-up of paste container to room temperature for up to 4 hours. 

Paste must be 19°C (66°F)

before processing. Verify paste

temperature with a thermometer 

to ensure paste is at 19°C (66°F)

or greater before setup. Printing can be performed at temperatures up to 32°C (89°F).

• Paste can be manually stirred

before use. A rotating, centrifugal force mixing operation is not required. If a rotating/centrifugal

force mixing is used, 30 - 60 seconds at 300 RPM is adequate. • Do not remove worked paste

from stencil and mix with

unused paste in jar. This will 

alter rheology of unused paste.

PRINTING：

STENCIL: Recommend 

ALPHA CUT, ALPHA 

NICKEL-CUT, ALPHA TETRABOND®, or ALPHAFORM stencils @ 0.100mm - 0.150 mm (4-6

mil) thick for 0.4 - 0.5 mm (0.016” or 0.020”) pitch. 

Stencil design is subject to

many process variables. 

Contact your local ALPHA 

Stencil site for advice. SQUEEGEE: Metal 

(recommended) PASTE ROLL: 1.5-2.0 cm 

diameter and make additions when roll reaches 1-cm (0.4”) diameter (min).

Max roll size will depend upon blade

PRESSURE: 0.45 to 0.7 

kg/inch

SPEED: 25 to 150mm

per second (1 to 6 inches per second).

STENCIL RELEASE SPEED: 3-10mm/sec.

PRINT PUMP HEAD: Passes

DEK ProFlow® compatibility

test

REFLOW 

(See Fig 1 & 2)：

ATMOSPHERE: Clean-dry

air or nitrogen atmosphere.

PROFILE (SAC Alloys): Acceptable reflow / 

coalescence for feature

size down to 8 mil (200 μm). IPC Class III voiding 

obtained for both straight ramp and

soak profiles.

Compatible with most common surface finishes. 

(Entek HT, Entek OM, Alpha Star, ENIG, SACX HASL)

NOTE 2: Refer to 

component and board 

supplier data for thermal properties at elevated temperatures. Lower peak

temperatures require longer 

TAL for improved joint 

cosmetics. Keeping the peak temperature below

240°C will lower the 

amount of voiding.

CLEANING：

ALPHA OM-340 (r)

residue is designed to remain on the 

board after reflow.

If reflowed residue

cleaning is required, the following aqueous

cleaners are 

recommended: In-line or Batch Cleaners - ALPHA BC-2200 - Zestron Vigon A201 - Zestron Vigon A250 - Zestron Vigon US

Manual or solvent

cleaning: - ALPHA SM-110 - ALPHA SM-110E 

Misprints and stencil cleaning may be done with the following 

cleaners: ALPHA SM-110E 

ALPHA SM-440

Zestron Vigon SC200

CONTACT INFORMATION：