WHD solder wire
1,Description:
WHD lead-free Solder wire is a low residue cored solder designed for cleanless welding applications. The unique blend of rosin and proprietary activators provides rapid wetness while leaving a minimal, transparent, completely inert residue with minimal and transparent residues, conforming to JIS Z 3283-86.
Model No. | W305
| W0307
| W307 | W4258 | |
specifications | Sn96.5Ag3.0Cu0.5 | Sn99.0Ag0.3Cu0.7 | Sn99.3Cu0.7 | Sn42Bi58 | |
Level | A | A | A | A | |
Dia (mm) | 0.2mm~3.0mm | 0.2mm~3.0mm | 0.2mm~3.0mm | 0.2mm~3.0mm | |
Content of Sn(wt%) | Balance | Balance | Balance | 42% | |
Content of Other mental c(wt%) | Ag:3.0±0.2 | Ag:0.3±0.1 Cu:0.7±0.2 | Cu:0.7±0.2 | BI:58 | |
Flux(wt%) | 2.5±0.5 | 2.5±0.5 | 2.5±0.5 | 2.5±0.5 | |
Dryness | Qualified | Qualified | Qualified | Qualified | |
Content0f Halogen
| Qualified | Qualified | Qualified | Qualified | |
WATER SOLUTION RESISTANT (Ω cm) | 50,000Above | 50,000Above | 50,000Above | 50,000Above | |
INSULATION RESISTANT (Ω) | 1×1011 Above | 1×1011 Above | 1×1011 Above | 1×1011 Above | |
EXPANSION RATE % | >75 | >75 | >75 | >75 | |
Copper Plate Corrosion | Qualified | Qualified | Qualified | Qualified | |
Melting point (℃) | 217 | 217~227 | 227℃ | 138℃ | |
2,Production Information
3,Alloy composition
LEVEL | Sn | Mental Content(wt%) | |||||||
Pb | Sb | Bi | Zn | Fe | Al | As | Cd |